M.A.Pruneda/C.Coll/H-Rezgui (CINN-CSIC/UB/INL) — Mapping heat dissipation mechanisms to improve electronic devices

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💻How can we shrink electronic devices minimizing heat and energy loss?💻

Modern telecommunication system rely heavily on extreme miniaturization, but downsizing presents a major bottleneck: as devices get smaller, heat dissipation becomes a critical challenge. 

The team formed by Miguel Pruneda (Centro de Investigación en Nanomateriales y Nanotecnología (CINN) (CSIC-UNIOVI-Principado Asturias)), Catalina Coll (Universitat de Barcelona) and Houssem Rezgui (INL - International Iberian Nanotechnology Laboratory) has explored how to engineer nanocrystalline silicon to tackle this challenge using #MareNostrum5 at the Barcelona Supercomputing Center.

🔎𝐖𝐡𝐚𝐭 𝐝𝐢𝐝 𝐭𝐡𝐞𝐲 𝐟𝐢𝐧𝐝?🔎 

🔹 Simulations identified unique vibrational modes trapped at grain boundaries
🔹 These vibrations do not easily exchange energy, preventing heat from dispersing naturally
🔹 This leads to localized heat accumulation at nanocrystal interfaces

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